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Contacts |
N/A Copper Alloy, 50 Micro-inches Gold Plate over Nickel |
Poting Material |
N/A Std. Epoxy: EP1730-1 or equivalent; colour: black, Hight Temp Epoxy EP173859 or equivalent |
Insert Retention (Class M) |
N/A Mil-DTL-83513, 50 lbs psi(Axial Load) |
Insert Retention E |
N/A EIA-364-29, 5 lbs min. (Axial Load) |
Coupling |
N/A Friction or Jackscrews into Jackposts/Threaded Inserts |
Contact Spacing |
N/A 0.05 (1.27) Centers |
Shell Styles (Gender) |
N/A Receptacle (Socket Contacts) |
Contact Termination |
N/A Multiple Indent Crimp |
Contact Rating |
N/A 3 amps max. |
Magnetic Permeability |
N/A ASTM-A342/A342M, 2.0 micro max. |
D.W.V. (Test Voltage rms 60 Hz ac volts) |
N/A EIA-364-20, at sea level: 600 vac for Solder Pot and Standard Wire at 70,000 ft Altitude (reduced barometric pressure): 150 vac for Solder Pot and Standard Wire |
Insulation Resistance |
N/A EIA-364-21, 5000 mefohms min. |
Contac Resistance EIA-364-23 |
N/A EIA-364-23, 8 milliohms at 3 amps |
Contact Engagement Force |
N/A MIL-DTL-83513, 6.0 oz. max. |
Contact Separation Force |
N/A MIL-DTL-83513, 0.5 oz. min. |
Contact Mating Force |
N/A MIL-DTL-83513,(10 oz. Times No. of Contacts) max. |
Contact Unmating Force |
N/A MIL-DTL-83513, (0.5 oz. Times No. of Contacts) min. |
Thermal Shock (Temperature Cycling) |
N/A EIA-364-32, Condition I, 5 Cycles - No physical damage, -55°C to +125°C (-67°F to +257°F) |
Mechanical Shock (Specified Pulse) |
N/A EIA-364-27, Condition E - No physical damage and Loosening of Parts, No Loss of Continuity > 1 microsec. |
Vibration |
N/A EIA-364-28, Condition IV - No physical damage and Loosening of Parts, No Loss of Continuity > 1 microsec. |
Durability |
N/A MIL-DTL-83513, 500 Mating Cycles at a Rate of 200 +/-100 CPH |
Salt Spray (Corrosion) |
N/A EIA-364-26, Condition B, Meets Mateability and contac resistance requirements |
Fluid Immersion |
N/A MIL-DTL-83513, 50 lbs psi (Axial Load) |
Humidity |
N/A EIA-364-31, Meets D.W.V. and Insulation Resistance Requirements 1 megohm min. after Step 6, 1000 mefohms min. agter 24 hrs of Conditioning |
Solderability |
N/A MILSTD-202, method 208, Withstand Test Condition |
Thermal Vacuum Outgassing (Space Classes) |
N/A SP-R-0022 or ASTM E595, Exceeds MIL-DTL-83513 Requirements; Standard is 1.0% max TML and 0.1% max VCM of Original Mass |